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Processing and Characterisation

A full range of electrical and optical spectroscopy characterisation techniques are available:

  • Temperature dependent CV, IV DLTS and Hall effect.  Carrier profiling from Hall or CV.
  • Automatic four point probe, ellipsometry and thermal wave systems for wafer mapping.
  • Optical characterisation including photoluminescence, photoreflectance etc.
A range of Processing Equipment and Techniques are also available:
  • Comprehensive furnace and RTA systems.
  • Comprehensive metal and dielectric deposition systems.
  • Photolithography to 1.5 microns.
Processes available include:
  • Electrical Isolation (up to 10 microns in III-Vs, for example).
  • Carrier lifetime modifications in silicon.
  • Ultra shallow doping.
  • Ion Beam Synthesis of oxides, nitrides, carbides, SiGe etc.
  • Corrosion and wear modification in metals.
  • Fabrication of waveguides by refractive index modification.
  • Semiconductor encapsulation and annealing.
  • Fabrication of test structures for feasibility studies.

  • Doping and synthesis of amorphous alloys for flat panel displays.

Last updated 20th November 2001
K.Arthur@surrey.ac.uk